Xiaomi has promised that its next flagship is going to be a blockbuster addition to the company's portfolio and we have heard rumors that it will be a beastly spec'd device. Images of the handset have already leaked online, but today we had a new one as the chassis of the Xiaomi Mi5 was revealed, super slim profile and all.







Chinese blogger IT Home posted the picture that shows the device will be very slender. The handset is expected to make its debut at the CES trade show in Las Vegas early next month, and considering that is a US based even, could it means Xiaomi will release the Mi5 in North America? That is still unlikely as the company has not actually ever launched a smartphone outside Asia and I doubt the strategy will change abruptly in January.

As for the specs, they are expected to be stellar and will arguably usher in the next generation of flagships. That will especially be the case if the Mi5 has a 64-bit Qualcomm Snapdragon 810 under the hood, but it could be too easy for that new chipset. Other goodies include a 5.7-inch Quad HD 1440 x 2560 resolution display, 3GB of RAM (although it could be as high as 4GB), and a Sony made Exmor 29.7 megapixel rear camera. That is an exciting cocktail of top shelf innards, while a nice design should accompany the handset too. The good news about the package is that Xiaomi's new flagship will cost just $325.


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